HyperSpring Contact Technology

HyperSpring contacts combine the high reliability of the Hypertac® Hyperboloid contact technology with the mechanical features of a spring-loaded contact to produce interconnections with improved signal integrity, high reliability and current density, and proven parametric stability over time.

The key innovation in a HyperSpring contact is that the spring itself is not used for electrical conduction: instead, conduction is handled by a Hypertac hyperboloid socket placed between the barrel and the plunger of a common spring-loaded contact. This means that the material used to form the spring may be chosen solely on the basis of its mechanical properties, primarily its elasticity. As a consequence it is possible to optimize the physical performance of the overall system.

HyperSpring produces superior electrical performance because the electrical properties of the conducting material do not need to be balanced with its physical performance. The use of the hyperboloid contact inside the HyperSpring guarantees all the features and benefits of the Hypertac technology.

Features and Benefits

• Spring-loaded contact with Hyperboloid socket
• Available with Hypertac Coax, Power and Signal Contacts
• Suitable for low height printed circuit board interconnect, and high density applications
• Provides cleaning contact action on harsh connection environment
• Provides reliable connection: mechanical provided by internal spring and electrical provided by internal pin and socket mating
• Easy replacement and maintenance
• Connection test system for microchip wafer testing

Download HyperSpring Catalog Pages (PDF 96 Kb)