| |
 Hypertronics
Licenses Ardent Concepts
Contact Technology for
Micro-Miniature Connectors
New Form Factor for Proven,
Solderless Interconnects
Optimized For Military/Aerospace
Designs
Hudson, MA (January
18, 2007) –
Hypertronics, the leading
provider of high performance
electrical connector and
interconnect solutions,
today announced a new
micro-miniature connector
technology optimized for
high reliability, military/aerospace
applications. Leveraging
a contact system licensed
from Ardent Concepts,
the new HyperGrid®
technology features:
- Ardent Concepts' RC
Springprobe™ contact
technology _ proven
in rugged test bed applications;
- Solderless, compression
style connections requiring
only 20 grams of force
per node to maintain
connectivity, with a
contact pitch as low
as 0.4 mm, ideal for
high density designs;
- Excellent AC performance,
with multi-GHz bandwidth,
exceptional signal integrity
and consistent DC resistance;
and
- Unequaled durability,
that exceeds 100K compression
cycles, with excellent
shock and vibration
performance.
HyperGrid technology
results in interconnect
solutions that offer the
same tiny form factor,
high node count and stackability
features required in many
micro-miniature applications,
without the electrical,
repeatability or cost
limitations associated
with other technologies
such as pogo pins, fuzz
buttons, and conductive
elastomers.
“Ardent's patented
contact technology provides
superior performance,
size and cost advantages
that are production-proven
in other high-reliability
applications,” said
Gordon Vinther, President
of Ardent Concepts. “Hypertronics'
expertise in meeting mil/aero
requirements makes them
an ideal partner for driving
our contact technology
into this market,"
The new scalable HyperGrid™
technology will be available
as custom interconnects
for PCB-to-PCB, flex cable-to-PCB,
and IC-to-PCB designs.
This new form factor
opens portable, handheld,
avionic and other space
and weight constrained
applications to the high
reliability, repeatability
and rugged designs of
Hypertronics. The license
agreement with Ardent
Concepts is exclusive
for military/aerospace
applications allowing
Hypertronics to provide
specialized mil/aero customers
a unique interconnect
solution not available
with any other vendor.
“Hypertronics is
always looking to acquire
technologies that are
complimentary to our high-reliability
Hypertac® hyperboloid
contact design,”
said Garry MacDonald,
Hypertronics Vice President
of Engineering and Business
Development. “This
license agreement with
Ardent Concepts enables
Hypertronics to expand
its custom interconnect
solutions to new applications
requiring micro-miniature
form factors.”
About Hypertronics
Corporation
Hypertronics, based in
Hudson, Massachusetts,
has been a leader in the
design, manufacturing
and distribution of specialty
connectors for the electronics
industry since 1970. Its
Hypertac® technology
is renowned for delivering
unfailing performance
in high-reliability applications
in the medical, military/aerospace,
test and measurement and
industrial market segments.
The company offers a wide
range of standard catalog
products as well as custom-designed
connectors for more specific
application needs and
performance requirements.
Hypertronics connectors
are used by leading mil/aero
customers whose mission-critical
land, naval and aerospace
systems require fail-safe
performance under the
harshest of operating
environments. Applications
include communications
and information systems,
sensors and electronics,
weapons, ground/sea systems,
air platforms, deep space
systems and missile defense.
It is a wholly owned subsidiary
of Smiths Group (UK:SMIN),
a multinational company
headquartered in London,
UK. More information about
Hypertronics products
and solution offerings
can be found at www.hypertronics.com.
For more information,
please contact:
Aubrey Valley_Marketing
Communications Specialist,
Hypertronics
Tel.: +1 978 568 0451
x343, Email: aubrey.valley@hypertronics.com
|
